产品名称：散热铜板组件
材质：C1100
加工方式：连续炉钎焊
应用领域：芯片散热
钎焊抗拉强度：340-390N/mm²
表面处理：抗氧化
Product name: Heat dissipation copper plate
subassembly
Material: C1100
Processing method: continuous furnace brazing
Application field: chip heat dissipation
Brazing tensile strength: 340-390N/mm ²
Surface treatment: antioxidant